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pc724v0nszxf series 1. recognized by ul1577, file no. e64380 (as model no. pc724v ) 2. package resin : ul flammability grade (94v-0) features agency approvals/compliance 1. programmable controllers 2. facsimiles 3. telephones applications dip 6 pin large input current photocoupler 1. 6 pin dip package 2. double transfer mold package (ideal for flow solder- ing) 3. large input current type (i f : max. 150ma) 4. high isolation voltage between input and output (v iso(rms) : 5.0kv) 5. lead-free and rohs directive compliant description pc724v0nszxf series contains an ired optically coupled to a phototransistor. it is packaged in a 6 pin dip, available in smt gullw- ing lead-form option. input-output isolation voltage(rms) is 5.0kv. ctr is 20% to 80% at input current of 100ma. 1 sheet no.: d2-a04202en date jun. 30. 2005 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. pc724v0nszxf series
internal connection diagram anode cathode nc emitter 1 1 2 3 4 collector 5 nc 6 2 6 5 3 4 2 sheet no.: d2-a04202en outline dimensions (unit : mm) 1. through-hole [ex. pc724v0nszxf ] 2. smt gullwing lead-form [ex. PC724V0NIPXF ] pc724v 7.12 0.5 : 0 to 13? 7.62 0.3 epoxy resin sharp mark "s" anode mark date code factory identification mark 6.5 0.5 0.6 0.2 1.2 0.3 1 2 3 6 5 4 0.5 typ. 2.9 0.5 0.5 0.1 2.54 0.25 3.25 0.5 3.5 0.5 pc724v 7.12 0.5 7.62 0.3 epoxy resin 6.5 0.5 0.6 0.2 1.2 0.3 2.54 0.25 3.5 0.5 0.35 0.25 1.0 + 0.4 ? 0 1.0 + 0.4 ? 0 10.0 + 0 ? 0.5 0.26 0.1 sharp mark "s" 1 2 3 6 5 4 anode mark date code factory identification mark pc724v0nszxf series product mass : approx. 0.35g plating material : sncu (cu : typ. 2%) product mass : approx. 0.36g
date code (2 digit) a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production factory identification mark no mark country of origin japan indonesia china * this factory marking is for identification purpose only. please contact the local sharp sales reprsentative to see the actual status of the production. rank mark there is no rank mark indicator. 3 repeats in a 20 year cycle sheet no.: d2-a04202en pc724v0nszxf series factory identification mark
sheet no.: d2-a04202en electro-optical characteristics parameter conditions forward voltage terminal capacitance collector dark current transfer charac- teristics emitter-collector breakdown voltage current transfer ratio collector-emitter breakdown voltage collector-emitter saturation voltage isolation resistance floating capacitance cut-off frequency min. ? ? ? 6 20 ? 5 10 10 ? ? ? ? typ. 1.4 30 ? ? ? ? 0.1 1 10 11 0.6 100 4 3 max. 1.7 250 100 ? ? 80 0.2 ? 1.0 ? 18 18 unit v v pf na v ma v ? pf khz s s symbol v f c t i ceo bv ceo bv eco i c v ce (sat) f c t r t f r iso c f response time rise time fall time input output i f = 100ma v = 0, f = 1khz reverse current ?? 10 a i r v r = 4v peak forward voltage ?? 3.0 v v fm i fm = 0.5a v ce = 20v, i f = 0 i c = 0.1ma, i f = 0 i e = 10 a, i f = 0 i f = 100ma, v ce = 2v dc500v, 40 to 60%rh v = 0, f = 1mhz v ce = 5v, i c = 2ma, r l = 100 ? v ce = 5v, i c = 2ma, r l = 100 ? ? 3db i f = 100ma, i c = 1ma 35 (t a = 25?c) absolute maximum ratings (t a = 25?c) parameter symbol unit input forward current ma *1 peak forward current a power dissipation reverse voltage mw v output collector-emitter voltage v emitter-collector voltage v collector current ma collector power dissipation mw *2 isolation voltage operating temperature total power dissipation ?c mw storage temperature ?c *3 soldering temperature i f i fm p v r v ceo v eco i c p c v iso (rms) t opr p tot t stg t sol ?c *1 pulse width 100 s, duty ratio : 0.001 *2 40 to 60%rh, ac for 1minute, f = 60hz *3 for 10s rating 150 1 230 6 35 6 80 160 ? 25 to + 100 320 ? 55 to + 125 260 5kv 4 pc724v0nszxf series
sheet no.: d2-a04202en model line-up lead form package model no. sleeve taping through-hole pcs/sleeve pcs/reel pc724v0nszxf smt gullwing pc724v0nizxf PC724V0NIPXF 5 please contact a local sharp sales representative to inquire about production status. pc724v0nszxf series
sheet no.: d2-a04202en 0 0.5 1 1.5 2 2.5 10 100 1 000 1 forward current i f (ma) forward voltage v f (v) t a = 25?c fig.6 forward current vs. forward voltage pulse width 100 s t a = 25?c 0.01 0.1 10 ? 2 10 ? 3 10 ? 1 1 10 1 peak forward current i fm (ma) duty ratio fig.5 peak forward current vs. duty ratio forward current i f (ma) ambient temperature t a (?c) 0 0 125 100 200 50 150 25 50 75 100 ? 25 fig.1 forward current vs. ambient temperature 0 0 125 100 200 50 150 160 25 50 75 100 ? 25 collector power dissipation p c (mw) ambient temperature t a (?c) fig.3 collector power dissipation vs. ambient temperature fig.2 diode power dissipation vs. ambient temperature fig.4 total power dissipation vs. ambient temperature 6 pc724v0nszxf series diode power dissipation p (mw) 250 200 150 100 50 0 025507 5 100 125 230 ? 25 ambient temperature t a (?c) 300 total power dissipation p tot (mw) ambient temperature t a (?c) 100 0 025507 5 100 125 ? 25 200 300 320 400 500
sheet no.: d2-a04202en ? 25 25 0 50 75 100 10 ? 10 10 ? 6 10 ? 7 10 ? 8 10 ? 9 collector dark current i ceo (a) ambient temperature ta ( c) v ce =20v fig.9 collector dark current vs. ambient temperature 7 fig.11 response time vs. load resistance fig.12 test circuit for response time collector-emitter saturation voltage v ce (sat) (v) 0 1 10 8 6 4 2 9 7 5 3 020406 080 100 forward current i f (ma) 5ma 10ma 20ma 30ma 40ma t a = 25?c i c = 1ma fig.10 collector-emitter saturation voltage vs. forward current 0.1 1 0.1 0.01 10 response time ( s) load resistance r l (k ? ) 1 10 100 t s t d t f t r v ce = 5v i c = 2ma t a = 25?c 90 % 10 % output input r l input output v ce v cc r d t d t s t r t f please refer to the conditions in fig.11 pc724v0nszxf series 0 0.1 20 40 100 10 1 100 80 60 current transfer ratio ctr (%) forward current i f (ma) v ce = 2v t a = 25?c fig.7 current transfer ratio vs. forward current 0 5 02468 50 40 30 20 10 10 collector current i c (ma) collector-emitter voltage v ce (v) 45 35 25 15 50ma 30ma 10ma t a = 25?c p c (max.) i f = 100ma fig.8 collector current vs. collector-emitter voltage
sheet no.: d2-a04202en 8 ? 20 ? 10 ? 15 ? 5 0 10 1 100 voltage gain a v (db) frequency f (khz) 5 10 1k ? 100 ? v ce = 5v i c = 2ma t a = 25?c r l = 10k ? fig.13 frequency response fig.14 test circuit for frequency response v cc r l output r d v ce please refer to the conditions in fig.13 remarks : please be aware that all data in the graph are just for reference and not for guarantee. pc724v0nszxf series
sheet no.: d2-a04202en design considerations while operating at i f <1.0ma, ctr variation may increase. please make design considering this fact. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5 years) into the design consideration. recommended foot print (reference) ? for additional design assistance, please review our corresponding optoelectronic application notes. 9 2.54 2.54 1.7 2.2 8.2 (unit : mm) design guide pc724v0nszxf series
sheet no.: d2-a04202en manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 270?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 10 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) pc724v0nszxf series
sheet no.: d2-a04202en solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3 minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?ead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated di- phenyl ethers (pbde). presence of odc 11 pc724v0nszxf series
sheet no.: d2-a04202en 12 12.0 6.7 5.8 10.8 520 2 package specification sleeve package package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 50 pcs. of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its anode mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions (unit : mm) pc724v0nszxf series
sheet no.: d2-a04202en 13 tape and reel package package materials carrier tape : a-pet (with anti-static material) cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions f k e i d j b h h a c g 5? max. dimensions list (unit:mm) a 16.0 0.3 b 7.5 0.1 c 1.75 0.1 d 12.0 0.1 e 2.0 0.1 h 10.4 0.1 i 0.4 0.05 j 4.2 0.1 k 7.8 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 a c e g f b d dimensions list (unit : mm) a 330 b 17.5 1.5 c 100 1.0 d 13 0.5 e 23 1.0 f 2.0 0.5 g 2.0 0.5 pull-out direction [packing : 1 000pcs/reel] reel structure and dimensions direction of product insertion pc724v0nszxf series
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems rela- ted to any intellectual property right of a third party re- sulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the spec- ifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufac- turing locations are also subject to change without no- tice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: - -- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high lev- el of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment - -- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall with- in the scope of strategic products described in the for- eign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp de- vices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, elec- tronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. 14 sheet no.: d2-a04202en important notices pc724v0nszxf series [e217]

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